Invention Grant
- Patent Title: Yttrium and titanium high-k dielectric films
- Patent Title (中): 钇和钛高k电介质膜
-
Application No.: US13677126Application Date: 2012-11-14
-
Publication No.: US08900418B2Publication Date: 2014-12-02
- Inventor: Imran Hashim , Hanhong Chen , Tony Chiang , Indranil De , Nobi Fuchigami , Edward Haywood , Pragati Kumar , Sandra Malhotra , Sunil Shanker
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose JP Tokyo
- Assignee: Intermolecular, Inc.,Elpida Memory, Inc.
- Current Assignee: Intermolecular, Inc.,Elpida Memory, Inc.
- Current Assignee Address: US CA San Jose JP Tokyo
- Main IPC: C23C14/34
- IPC: C23C14/34 ; B05D5/12 ; H01L49/02 ; C23C16/40 ; C23C16/455 ; H01L21/314 ; H01L21/316 ; H01L27/108 ; H01L21/02

Abstract:
This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on yttrium and titanium, to have a high dielectric constant and low leakage characteristic and (b) related devices and structures. An oxide layer having both yttrium and titanium may be fabricated either as an amorphous oxide or as an alternating series of monolayers. In several embodiments, the oxide is characterized by a yttrium contribution to total metal that is specifically controlled. The oxide layer can be produced as the result of a reactive process, if desired, via either a PVD process or, alternatively, via an atomic layer deposition process that employs specific precursor materials to allow for a common process temperature window for both titanium and yttrium reactions.
Public/Granted literature
- US20130071990A1 Yttrium and Titanium High-K Dielectric Films Public/Granted day:2013-03-21
Information query
IPC分类: