发明授权
- 专利标题： Deposition ring and electrostatic chuck for physical vapor deposition chamber
- 专利标题（中）： 用于物理气相沉积室的沉积环和静电吸盘
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申请号： US13280771申请日： 2011-10-25
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公开(公告)号： US08911601B2公开(公告)日： 2014-12-16
- 发明人: Muhammad Rasheed , Keith A. Miller , Rongjun Wang
- 申请人： Muhammad Rasheed , Keith A. Miller , Rongjun Wang
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： C25B9/00
- IPC分类号： C25B9/00 ; C25B11/00 ; C25B13/00 ; C23C14/00 ; B05C13/00 ; B05C13/02 ; B05C21/00 ; C23C16/00 ; C23C14/34 ; C23C16/458 ; C23C14/50 ; C23C14/56 ; H01L21/687
摘要：
Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.