Invention Grant
US08961807B2 CMP compositions with low solids content and methods related thereto
有权
具有低固体含量的CMP组合物和与其相关的方法
- Patent Title: CMP compositions with low solids content and methods related thereto
- Patent Title (中): 具有低固体含量的CMP组合物和与其相关的方法
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Application No.: US13841344Application Date: 2013-03-15
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Publication No.: US08961807B2Publication Date: 2015-02-24
- Inventor: Lin Fu , Steven Grumbine
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas E Omholt; Salim Hasan; Arlene Hornilla
- Main IPC: C03C15/00
- IPC: C03C15/00 ; C09G1/02 ; B44C1/22

Abstract:
Disclosed are a polishing composition and method of polishing a substrate. The composition has low-load (e.g., up to about 0.1 wt. %) of abrasive particles. The polishing composition also contains water and at least one anionic surfactant. In some embodiments, the abrasive particles are alpha alumina particles (e.g., coated with organic polymer). The polishing composition can be used, e.g., to polish a substrate of weak strength such as an organic polymer. An agent for oxidizing at least one of silicon and organic polymer is included in the composition in some embodiments.
Public/Granted literature
- US20140263184A1 CMP COMPOSITIONS WITH LOW SOLIDS CONTENT AND METHODS RELATED THERETO Public/Granted day:2014-09-18
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