Invention Grant
- Patent Title: Wetting pretreatment for enhanced damascene metal filling
- Patent Title (中): 润湿预处理用于增强镶嵌金属填充
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Application No.: US12684787Application Date: 2010-01-08
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Publication No.: US08962085B2Publication Date: 2015-02-24
- Inventor: Steven T. Mayer , David W. Porter , Mark J. Willey
- Applicant: Steven T. Mayer , David W. Porter , Mark J. Willey
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: C25D5/34
- IPC: C25D5/34 ; B05D5/12 ; H05K3/00 ; B05D3/00 ; C25D5/02 ; B05D1/02 ; B05D1/18 ; B23H3/00 ; C25D7/12 ; H01L21/288 ; H01L21/768 ; C25D17/00 ; C25D21/04 ; C25D5/00 ; C25D3/38
Abstract:
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
Public/Granted literature
- US20100320609A1 WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING Public/Granted day:2010-12-23
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