发明授权
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US13349190申请日： 2012-01-12
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公开(公告)号： US08968475B2公开(公告)日： 2015-03-03
- 发明人: Masaya Odagiri , Shigeki Tozawa , Hajime Ugajin
- 申请人： Masaya Odagiri , Shigeki Tozawa , Hajime Ugajin
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Nath, Goldberg & Meyer
- 代理商 Jerald L. Meyer; Katelyn J. Bernier
- 优先权： JP2011-004781 20110113
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; H01L21/67
摘要：
A substrate processing apparatus, which is provided with a processing chamber configured to process a substrate and capable of being depressurized, includes a substrate placing table configured to place a substrate; a baffle plate disposed around the substrate placing table so as to divide an inside of the processing chamber into a processing space and an exhaust space; and an exhaust port configured to exhaust the inside of the processing chamber. A gap is formed between the substrate placing table and the baffle plate and a plurality of communication holes are formed in the baffle plate so that the processing space and the exhaust space communicate with each other.
公开/授权文献
- US20120180883A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日：2012-07-19
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