Invention Grant
- Patent Title: Evaporator, evaporation method and substrate processing apparatus
- Patent Title (中): 蒸发器,蒸发法和底物处理装置
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Application No.: US14033829Application Date: 2013-09-23
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Publication No.: US09003674B2Publication Date: 2015-04-14
- Inventor: Mikio Nakashima , Yuji Kamikawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2008-228752 20080905
- Main IPC: F26B5/00
- IPC: F26B5/00 ; F26B5/16 ; B01D1/02 ; B01D1/30 ; B01D1/06 ; B01B1/00

Abstract:
Disclosed are an evaporator, an evaporation method, and a substrate processing apparatus, which can increase the concentration of generated vapor of an organic solvent and efficiently heat the organic solvent. The evaporator includes a fluid tube, a liquid organic solvent supply device for supplying the organic solvent liquid to one end of the fluid tube, and heating units for heating the fluid tube. The fluid tube has a cross section that increases from the one end to the other end. When the organic solvent liquid supplied to one end of the fluid tube is heated, the organic solvent vapor is discharged from the other end of the fluid tube. The substrate processing apparatus includes the above-described evaporator.
Public/Granted literature
- US20140020849A1 EVAPORATOR, EVAPORATION METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2014-01-23
Information query
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