Invention Grant
- Patent Title: Platen control
- Patent Title (中): 压板控制
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Application No.: US13270644Application Date: 2011-10-11
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Publication No.: US09012337B2Publication Date: 2015-04-21
- Inventor: Shengwu Chang , Joseph C. Olson , Frank Sinclair , Matthew P. McClellan , Antonella Cucchetti
- Applicant: Shengwu Chang , Joseph C. Olson , Frank Sinclair , Matthew P. McClellan , Antonella Cucchetti
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/66 ; H01L21/67
Abstract:
A system and method for maintain a desired degree of platen flatness is disclosed. A laser system is used to measure the flatness of a platen. The temperature of the platen is then varied to achieve the desired level of flatness. In some embodiments, this laser system is only used during a set up period and the resulting desired temperature is then used during normal operation. In other embodiments, a laser system is used to measure the flatness of the platen, even while the workpiece is being processed.
Public/Granted literature
- US20120088035A1 PLATEN CONTROL Public/Granted day:2012-04-12
Information query
IPC分类:
