发明授权
- 专利标题： Platen control
- 专利标题（中）： 压板控制
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申请号： US13270644申请日： 2011-10-11
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公开(公告)号： US09012337B2公开(公告)日： 2015-04-21
- 发明人: Shengwu Chang , Joseph C. Olson , Frank Sinclair , Matthew P. McClellan , Antonella Cucchetti
- 申请人： Shengwu Chang , Joseph C. Olson , Frank Sinclair , Matthew P. McClellan , Antonella Cucchetti
- 申请人地址： US MA Gloucester
- 专利权人： Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人： Varian Semiconductor Equipment Associates, Inc.
- 当前专利权人地址： US MA Gloucester
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/66 ; H01L21/67
摘要：
A system and method for maintain a desired degree of platen flatness is disclosed. A laser system is used to measure the flatness of a platen. The temperature of the platen is then varied to achieve the desired level of flatness. In some embodiments, this laser system is only used during a set up period and the resulting desired temperature is then used during normal operation. In other embodiments, a laser system is used to measure the flatness of the platen, even while the workpiece is being processed.
公开/授权文献
- US20120088035A1 PLATEN CONTROL 公开/授权日：2012-04-12
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