Invention Grant
US09041159B2 Epitaxial structure and epitaxial growth method for forming epitaxial layer with cavities
有权
外延结构和外延生长方法,用于形成具有空腔的外延层
- Patent Title: Epitaxial structure and epitaxial growth method for forming epitaxial layer with cavities
- Patent Title (中): 外延结构和外延生长方法,用于形成具有空腔的外延层
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Application No.: US13932665Application Date: 2013-07-01
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Publication No.: US09041159B2Publication Date: 2015-05-26
- Inventor: Jun-Rong Chen , Hsiu-Mei Chou , Jhao-Cheng Ye
- Applicant: LEXTAR ELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: LEXTAR ELECTRONICS CORPORATION
- Current Assignee: LEXTAR ELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Moser Taboada
- Priority: TW101124450A 20120706
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L33/02 ; H01L33/00 ; H01L33/12 ; H01L21/02 ; C30B23/04 ; C30B25/04 ; C30B29/40

Abstract:
An epitaxial growth method includes the steps of: providing a substrate; forming a sacrifice layer on the substrate; patterning the sacrifice layer to form a plurality of bumps spaced apart from each other on the substrate; epitaxially forming a first epitaxial layer on the substrate to cover a portion of each of the bumps; removing the bumps to form a plurality of cavities; and epitaxially forming a second epitaxial layer on the first epitaxial layer such that the cavities are enclosed by the first epitaxial layer and the second epitaxial layer. An epitaxial structure grown by the method is disclosed as well.
Public/Granted literature
- US20140008766A1 EPITAXIAL STRUCTURE AND EPITAXIAL GROWTH METHOD FOR FORMING EPITAXIAL LAYER WITH CAVITIES Public/Granted day:2014-01-09
Information query
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