发明授权
- 专利标题： Forming light-emitting diodes using seed particles
- 专利标题（中）： 使用种子颗粒形成发光二极管
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申请号： US14038881申请日： 2013-09-27
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公开(公告)号： US09065015B2公开(公告)日： 2015-06-23
- 发明人: Jung-Tang Chu , Ching-Hua Chiu , Hung-Wen Huang , Yea-Chen Lee , Hsing-Kuo Hsia
- 申请人： TSMC Solid State Lighting Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TSMC SOLID STATE LIGHTING LTD.
- 当前专利权人： TSMC SOLID STATE LIGHTING LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L33/32
- IPC分类号： H01L33/32 ; H01L33/30 ; H01L21/02 ; H01L33/00 ; H01L33/12 ; H01L33/16
摘要：
A device includes a substrate; a group III-V semiconductor layer disposed over the substrate; and a seed layer disposed over the group III-V semiconductor layer. The substrate is a printed circuit board. The group III-V semiconductor layer includes a multiple quantum well (MQW) layer, a p-type doped layer, and an n-type doped layer. The seed layer includes a plurality of miniature elements. The miniature elements each contain a single-crystal material suitable for epitaxially growing the group III-V semiconductor layer. The miniature elements collectively cover less than 100% of a surface of the group III-V semiconductor layer.
公开/授权文献
- US20140021483A1 Forming Light-Emitting Diodes Using Seed Particles 公开/授权日：2014-01-23
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