Invention Grant
- Patent Title: Packaging methods and structures for semiconductor devices
- Patent Title (中): 半导体器件的封装方法和结构
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Application No.: US14523248Application Date: 2014-10-24
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Publication No.: US09082636B2Publication Date: 2015-07-14
- Inventor: Chih-Wei Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chun-Cheng Lin , Meng-Tse Chen , Chen-Hua Yu , Mirng-Ji Lii , Chung-Shi Liu , Bor-Ping Jang , Hsiu-Jen Lin , Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/065 ; H01L23/498 ; H01L21/56 ; H01L23/00 ; H01L21/683 ; H01L25/00 ; H01L23/538 ; H01L21/52 ; H01L21/768 ; H01L23/31 ; H01L25/03 ; H01L25/10
Abstract:
Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
Public/Granted literature
- US20150044819A1 Packaging Methods and Structures for Semiconductor Devices Public/Granted day:2015-02-12
Information query
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