Invention Grant
- Patent Title: Lead pin for package substrate
- Patent Title (中): 封装基板引脚
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Application No.: US14302045Application Date: 2014-06-11
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Publication No.: US09142499B2Publication Date: 2015-09-22
- Inventor: Ki Taek Lee , Hueng Jae Oh , Sung Won Jeong , Gi Sub Lee , Jin Won Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MACHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MACHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2009-0089707 20090922; KR10-2009-0123275 20091211; KR10-2009-0125087 20091215
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/498
Abstract:
A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.
Public/Granted literature
- US20140291851A1 LEAD PIN FOR PACKAGE SUBSTRATE Public/Granted day:2014-10-02
Information query
IPC分类:
