公开(公告)号：US08708215B2

公开(公告)日：2014-04-29

申请号：US13894312

申请日：2013-05-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hueng Jae Oh ,  Yon Ho You ,  Jin Won Choi

IPC: B23K37/00

CPC classification number: B23K3/0623

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract translation: 本发明公开了一种焊球供给装置，其特征在于，包括：盒形状，盒内嵌有多个焊球; 耦合到所述盒的下部的振动单元; 以及金属掩模，与所述振动单元的下部一体地结合，并且在其整个表面上形成有多个孔。

公开(公告)号：US08651356B2

公开(公告)日：2014-02-18

申请号：US13675235

申请日：2012-11-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Noriaki Mukai ,  Hueng Jae Oh ,  Dae Young Lee ,  Jin Won Choi

IPC: B23K1/00 ,  B23K1/08

CPC classification number: B23K3/0661 ,  B23K3/0653

Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Abstract translation: 这里公开了一种在衬底上进行焊接工艺的焊料凸点形成装置，该焊料凸点形成装置包括：焊料槽，其中容纳焊料; 搅拌器搅动焊料槽中的焊料; 驱动搅拌器的司机 以及向衬底提供吸力的抽吸压力提供器。

公开(公告)号：US20130306709A1

公开(公告)日：2013-11-21

申请号：US13894312

申请日：2013-05-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hueng Jae Oh ,  Yon Ho You ,  Jin Won Choi

IPC: B23K3/06

CPC classification number: B23K3/0623

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract translation: 本发明公开了一种焊球供给装置，其特征在于，包括：盒形状，盒内嵌有多个焊球; 耦合到所述盒的下部的振动单元; 以及金属掩模，与所述振动单元的下部一体地结合，并且在其整个表面上形成有多个孔。

公开(公告)号：US09142499B2

公开(公告)日：2015-09-22

申请号：US14302045

申请日：2014-06-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Taek Lee ,  Hueng Jae Oh ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC: H01L23/12 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract translation: 用于封装衬底的引脚包括：连接销插入形成在外部衬底中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。