发明授权
- 专利标题: Semiconductor light emitting device and wafer
- 专利标题(中): 半导体发光器件和晶圆
-
申请号: US13206700申请日: 2011-08-10
-
公开(公告)号: US09142717B2公开(公告)日: 2015-09-22
- 发明人: Koichi Tachibana , Shigeya Kimura , Hajime Nago , Shinya Nunoue
- 申请人: Koichi Tachibana , Shigeya Kimura , Hajime Nago , Shinya Nunoue
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2011-108794 20110513
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L21/00 ; H01L33/12 ; B82Y20/00 ; H01L33/20 ; H01L33/22 ; H01L33/06 ; H01L33/08 ; H01L33/32 ; H01S5/34 ; H01S5/343
摘要:
According to one embodiment, a semiconductor light emitting device includes: a foundation layer, a first semiconductor layer, a light emitting part, and a second semiconductor layer. The foundation layer includes a nitride semiconductor. The foundation layer has a dislocation density not more than 5×108 cm−2. The first semiconductor layer of a first conductivity type is provided on the foundation layer and includes a nitride semiconductor. The light emitting part is provided on the first semiconductor layer. The light emitting part includes: a plurality of barrier layers; and a well layer provided between the barrier layers. The well layer has a bandgap energy smaller than a bandgap energy of the barrier layers and has a thickness larger than a thickness of the barrier layers. The second semiconductor layer of a second conductivity type different from the first conductivity type, is provided on the light emitting part and includes a nitride semiconductor.
公开/授权文献
- US20120286284A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND WAFER 公开/授权日:2012-11-15
信息查询
IPC分类: