Invention Grant
- Patent Title: Semiconductor-laser-device assembly
- Patent Title (中): 半导体激光器件组装
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Application No.: US14264773Application Date: 2014-04-29
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Publication No.: US09184560B2Publication Date: 2015-11-10
- Inventor: Shunsuke Kono , Masaru Kuramoto , Rintaro Koda
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2013-099177 20130509
- Main IPC: H01S3/098
- IPC: H01S3/098 ; H01S5/065 ; H01S5/343 ; H01S5/50 ; H01S5/14 ; H01S5/06 ; H01S5/40 ; H01S3/23 ; H01S5/00 ; H01S5/10 ; H01S5/22
Abstract:
A semiconductor-laser-device assembly includes a mode-locked semiconductor-laser-element assembly including a mode-locked semiconductor laser element, and a dispersion compensation optical system, on which laser light emitted from the mode-locked semiconductor laser element is incident and from which the laser light is emitted; and a semiconductor optical amplifier having a layered structure body including a group III-V nitride-based semiconductor layer, the semiconductor optical amplifier configured to amplify the laser light emitted from the mode-locked semiconductor-laser-element assembly.
Public/Granted literature
- US20140376575A1 SEMICONDUCTOR-LASER-DEVICE ASSEMBLY Public/Granted day:2014-12-25
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