Invention Grant
US09190471B2 Semiconductor structure having a source and a drain with reverse facets
有权
具有反向刻面的源极和漏极的半导体结构
- Patent Title: Semiconductor structure having a source and a drain with reverse facets
- Patent Title (中): 具有反向刻面的源极和漏极的半导体结构
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Application No.: US13446350Application Date: 2012-04-13
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Publication No.: US09190471B2Publication Date: 2015-11-17
- Inventor: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Jinghong Li , Alexander Reznicek
- Applicant: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Jinghong Li , Alexander Reznicek
- Applicant Address: US NY Hopewell Junction
- Assignee: GLOBALFOUNDRIES U.S.2 LLC
- Current Assignee: GLOBALFOUNDRIES U.S.2 LLC
- Current Assignee Address: US NY Hopewell Junction
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/336 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L21/84

Abstract:
A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron.
Public/Granted literature
- US20130270611A1 SEMICONDUCTOR STRUCTURE HAVING A SOURCE AND A DRAIN WITH REVERSE FACETS Public/Granted day:2013-10-17
Information query
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