Invention Grant
- Patent Title: Litho cluster and modulization to enhance productivity
- Patent Title (中): Litho集群和模块化以提高生产力
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Application No.: US14551302Application Date: 2014-11-24
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Publication No.: US09196515B2Publication Date: 2015-11-24
- Inventor: I-Hsiung Huang , Heng-Hsin Liu , Heng-Jen Lee , Chin-Hsiang Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/317 ; H01J37/32 ; H01J37/16 ; H01J37/20 ; G03F7/16 ; G03F7/30 ; G03F7/20 ; H01L21/677

Abstract:
The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.
Public/Granted literature
- US20150076371A1 LITHO CLUSTER AND MODULIZATION TO ENHANCE PRODUCTIVITY Public/Granted day:2015-03-19
Information query
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