公开(公告)号：US20150076371A1

公开(公告)日：2015-03-19

申请号：US14551302

申请日：2014-11-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Hsiung Huang ,  Heng-Hsin Liu ,  Heng-Jen Lee ,  Chin-Hsiang Lin

IPC: H01L21/67 ,  H01J37/20 ,  H01J37/16 ,  H01J37/32 ,  H01J37/317

CPC classification number: H01L21/67225 ,  G03F7/16 ,  G03F7/30 ,  G03F7/70991 ,  H01J37/16 ,  H01J37/20 ,  H01J37/3174 ,  H01J37/32899 ,  H01L21/67276 ,  H01L21/67745

Abstract: The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.

Abstract translation: 本公开涉及一种用于半导体工件加工的平版印刷工具装置。 光刻工具装置将光刻工具组合成簇，并且将半导体工件在第一簇中的第一类型的多个光刻工具之间选择性地传输到第二簇中的第二类型的光刻工具。 通过转移组件实现选择性转移，转移组件耦合到识别第一类型的光刻工具中产生的缺陷的缺陷扫描工具。 所公开的平版印刷工具装置还利用共同的结构元件，例如壳体组件和诸如气体和化学品的共享功能元件。 光刻工具装置可以包括被配置成提供这些各种部件的模块化的烘烤，涂覆，曝光和显影单元，以便为给定的光刻制造工艺优化产量和效率。

公开(公告)号：US09196515B2

公开(公告)日：2015-11-24

申请号：US14551302

申请日：2014-11-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Hsiung Huang ,  Heng-Hsin Liu ,  Heng-Jen Lee ,  Chin-Hsiang Lin

IPC: H01L21/67 ,  H01J37/317 ,  H01J37/32 ,  H01J37/16 ,  H01J37/20 ,  G03F7/16 ,  G03F7/30 ,  G03F7/20 ,  H01L21/677

CPC classification number: H01L21/67225 ,  G03F7/16 ,  G03F7/30 ,  G03F7/70991 ,  H01J37/16 ,  H01J37/20 ,  H01J37/3174 ,  H01J37/32899 ,  H01L21/67276 ,  H01L21/67745

Abstract: The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.

Abstract translation: 本公开涉及一种用于半导体工件加工的平版印刷工具装置。 光刻工具装置将光刻工具组合成簇，并且将半导体工件在第一簇中的第一类型的多个光刻工具之间选择性地传输到第二簇中的第二类型的光刻工具。 通过转移组件实现选择性转移，转移组件耦合到识别第一类型的光刻工具中产生的缺陷的缺陷扫描工具。 所公开的平版印刷工具装置还利用共同的结构元件，例如壳体组件和诸如气体和化学品的共享功能元件。 光刻工具装置可以包括被配置成提供这些各种部件的模块化的烘烤，涂覆，曝光和显影单元，以便为给定的光刻制造工艺优化产量和效率。