Invention Grant
- Patent Title: Conductivity of resin materials and composite materials
- Patent Title (中): 树脂材料和复合材料的电导率
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Application No.: US14536414Application Date: 2014-11-07
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Publication No.: US09202607B2Publication Date: 2015-12-01
- Inventor: John Cawse , Martin Simmons
- Applicant: Hexcel Composites Limited
- Applicant Address: GB Cambridge
- Assignee: Hexcel Composites Limited
- Current Assignee: Hexcel Composites Limited
- Current Assignee Address: GB Cambridge
- Agent W. Mark Bielawski; David J. Oldenkamp
- Priority: GB0810453.1 20080607
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C08G59/50 ; C08K7/06 ; C08K7/24 ; C08G59/02 ; C08J5/24 ; C08L53/00

Abstract:
A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.
Public/Granted literature
- US20150060738A1 Conductivity of Resin Materials and Composite Materials Public/Granted day:2015-03-05
Information query