Conductivity of Resin Materials and Composite Materials
    3.
    发明申请
    Conductivity of Resin Materials and Composite Materials 审中-公开
    树脂材料和复合材料的电导率

    公开(公告)号:US20150060738A1

    公开(公告)日:2015-03-05

    申请号:US14536414

    申请日:2014-11-07

    Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

    Abstract translation: 提供一种树脂材料,其包括至少一种热固性树脂,导电添加剂材料和至少一种热塑性聚合物树脂。 热塑性聚合物树脂溶解在热固性聚合物树脂中,固化后相分离。 还提供了一种制备树脂材料的方法,另外还提供了一种包括所述树脂材料与纤维增强材料组合的复合材料。 树脂材料和复合材料可以以未固化或固化的形式使用,并且可以特别用作预浸料材料。

    STRUCTURED THERMOPLASTIC IN COMPOSITE INTERLEAVES

    公开(公告)号:US20180361682A1

    公开(公告)日:2018-12-20

    申请号:US16108640

    申请日:2018-08-22

    Abstract: One or more layers of structured thermoplastic polymer are located within the interleaf zones of a preform or prepreg. The structured thermoplastic polymer is a film or membrane formed by: a) dissolving polyethersulfone or polyetherimide in a solvent to form a polymer dope; b) dispersing a curing agent for an epoxy resin in the polymer dope to form a curative-enriched polymer dope; c) casting the curative-enriched polymer dope onto a surface to form a dope layer; and d) removing the solvent from the dope layer to form a layer of structured thermoplastic polymer.

    Conductivity of resin materials and composite materials
    9.
    发明授权
    Conductivity of resin materials and composite materials 有权
    树脂材料和复合材料的电导率

    公开(公告)号:US09202607B2

    公开(公告)日:2015-12-01

    申请号:US14536414

    申请日:2014-11-07

    Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

    Abstract translation: 提供一种树脂材料,其包括至少一种热固性树脂,导电添加剂材料和至少一种热塑性聚合物树脂。 热塑性聚合物树脂溶解在热固性聚合物树脂中,固化后相分离。 还提供了一种制备树脂材料的方法,另外还提供了一种包括所述树脂材料与纤维增强材料组合的复合材料。 树脂材料和复合材料可以以未固化或固化的形式使用,并且可以特别用作预浸料材料。

    THERMOPLASTIC TOUGHENING MATERIAL AND RELATED METHOD
    10.
    发明申请
    THERMOPLASTIC TOUGHENING MATERIAL AND RELATED METHOD 有权
    热塑性增韧材料及相关方法

    公开(公告)号:US20140110877A1

    公开(公告)日:2014-04-24

    申请号:US14133965

    申请日:2013-12-19

    CPC classification number: B29C70/025 B29C70/086 C08J5/24

    Abstract: A non-fibrous, apertured membrane comprises at least one thermoplastic polymeric material and has a discrete porous structure. The membrane is soluble in the thermoset matrix polymer of a composite material.

    Abstract translation: 非纤维状多孔膜包含至少一种热塑性聚合物材料并且具有离散的多孔结构。 膜可溶于复合材料的热固性基质聚合物。

Patent Agency Ranking