Invention Grant
- Patent Title: Constructions comprising thermally conductive stacks containing rutile-type titanium oxide
- Patent Title (中): 包括含有金红石型氧化钛的导热叠层的结构
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Application No.: US13956211Application Date: 2013-07-31
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Publication No.: US09209013B2Publication Date: 2015-12-08
- Inventor: Nik Mirin , Tsai-Yu Huang , Vishwanath Bhat , Chris M. Carlson , Vassil N. Antonov
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/40 ; C23C16/455 ; H01G4/08 ; H01G4/12 ; H01G4/33 ; H01L27/108 ; H01L49/02 ; C01G23/04 ; H01L23/373 ; H05K1/02

Abstract:
Some embodiments include methods of forming rutile-type titanium oxide. A monolayer of titanium nitride may be formed. The monolayer of titanium nitride may then be oxidized at a temperature less than or equal to about 550° C. to convert it into a monolayer of rutile-type titanium oxide. Some embodiments include methods of forming capacitors that have rutile-type titanium oxide dielectric, and that have at least one electrode comprising titanium nitride. Some embodiments include thermally conductive stacks that contain titanium nitride and rutile-type titanium oxide, and some embodiments include methods of forming such stacks.
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