Invention Grant
- Patent Title: High-integration semiconductor device and method for fabricating the same
- Patent Title (中): 高集成半导体器件及其制造方法
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Application No.: US14683525Application Date: 2015-04-10
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Publication No.: US09209184B2Publication Date: 2015-12-08
- Inventor: Ju-Youn Kim , Hyung-Soon Jang , Jong-Mil Youn , Tae-Won Ha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2013-0082936 20130715
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/423 ; H01L21/8238 ; H01L29/49 ; H01L29/51

Abstract:
A semiconductor device includes a substrate including a first active region, a second active region and a field region between the first and second active regions, and a gate structure formed on the substrate to cross the first active region, the second active region and the field region. The gate structure includes a p type metal gate electrode and an n-type metal gate electrode directly contacting each other, the p-type metal gate electrode extends from the first active region less than half way toward the second active region.
Public/Granted literature
- US20150214227A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2015-07-30
Information query
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