SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20140239405A1

    公开(公告)日:2014-08-28

    申请号:US13834488

    申请日:2013-03-15

    Abstract: A semiconductor device using a high-k dielectric film is provided. The semiconductor device comprises a first gate insulating layer on a substrate and a first barrier layer on the first gate insulating layer, the first barrier layer having a first thickness. A first work function control layer is on the first barrier layer. A second barrier layer is present on the first work function control layer, the second barrier layer having a second thickness that is less than the first thickness.

    Abstract translation: 提供了使用高k电介质膜的半导体器件。 半导体器件包括衬底上的第一栅极绝缘层和第一栅极绝缘层上的第一势垒层,第一势垒层具有第一厚度。 第一功能控制层位于第一阻挡层上。 第二阻挡层存在于第一功函数控制层上,第二阻挡层具有小于第一厚度的第二厚度。

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