Invention Grant
- Patent Title: Controlling sprinting for thermal capacity boosted systems
- Patent Title (中): 控制用于热容量提升系统的冲刺
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Application No.: US13925269Application Date: 2013-06-24
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Publication No.: US09213585B2Publication Date: 2015-12-15
- Inventor: Manish Arora , Nuwan Jayasena , Michael Schulte
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Sunnyvale
- Agency: Volpe and Koenig, P.C.
- Main IPC: G06F9/46
- IPC: G06F9/46 ; G06F15/00 ; G06F9/50 ; G06F1/20 ; G06F1/32 ; G06F9/30
Abstract:
A method and apparatus are described for performing sprinting in a processor. An analyzer in the processor may monitor thermal capacity remaining in the processor while not sprinting. When the remaining thermal capacity is sufficient to support sprinting, the analyzer may perform sprinting of a new workload when a benefit derived by sprinting the new workload exceeds a threshold and does not cause the remaining thermal capacity in the processor to be exhausted. The analyzer may perform sprinting of the new workload in accordance with sprinting parameters determined for the new workload. The analyzer may continue to monitor the remaining thermal capacity while not sprinting when the benefit derived by sprinting the new workload does not exceed the threshold.
Public/Granted literature
- US20140380329A1 CONTROLLING SPRINTING FOR THERMAL CAPACITY BOOSTED SYSTEMS Public/Granted day:2014-12-25
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