发明授权
- 专利标题: Optoelectronic semiconductor chip
- 专利标题(中): 光电半导体芯片
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申请号: US14382286申请日: 2013-02-20
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公开(公告)号: US09214600B2公开(公告)日: 2015-12-15
- 发明人: Martin Mandl , Martin Straβburg , Christopher Kölper , Alexander Pfeuffer , Patrick Rode , Johannes Ledig , Richard Neumann , Andreas Waag
- 申请人: OSRAM Opto Semiconductors GmbH
- 申请人地址: DE Regensburg
- 专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人地址: DE Regensburg
- 代理机构: Slater & Matsil, L.L.P.
- 优先权: DE102012101718 20120301
- 国际申请: PCT/EP2013/053371 WO 20130220
- 国际公布: WO2013/127672 WO 20130906
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L33/08 ; H01L33/18 ; H01L33/42 ; H01L33/62 ; H01L33/38
摘要:
An optoelectronic semiconductor chip includes a number active regions that are arranged at a distance from each other and a substrate that is arranged on an underside of the active regions. One of the active regions has a main extension direction. The active region has a core region that is formed using a first semiconductor material. The active region has an active layer that covers the core region at least in directions perpendicular to the main extension direction of the active region. The active region has a cover layer that is formed using a second semiconductor material and covers the active layer at least in directions perpendicular to the main extension direction of the active region.
公开/授权文献
- US20150021636A1 Optoelectronic Semiconductor Chip 公开/授权日:2015-01-22
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