Invention Grant
US09224644B2 Method to control depth profiles of dopants using a remote plasma source 有权
使用远程等离子体源控制掺杂剂深度分布的方法

Method to control depth profiles of dopants using a remote plasma source
Abstract:
Methods and apparatus for processing using a remote plasma source are disclosed. The apparatus includes an outer chamber enclosing a substrate support, a remote plasma source, and a showerhead. A substrate heater can be mounted in the substrate support. A transport system moves the substrate support and is capable of positioning the substrate. The remote plasma source may be used to provide a plasma surface treatment or as a source to incorporate dopants into a pre-deposited layer.
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