Invention Grant
- Patent Title: High voltage semiconductor device and method for fabricating the same
- Patent Title (中): 高压半导体器件及其制造方法
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Application No.: US14468503Application Date: 2014-08-26
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Publication No.: US09224862B2Publication Date: 2015-12-29
- Inventor: Wei-Chun Chou , Yi-Hung Chiu , Chu-Feng Chen , Cheng-Yi Hsieh , Chung-Ren Lao
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L29/10 ; H01L29/66 ; H01L29/08 ; H01L29/423

Abstract:
A high voltage semiconductor device is provided. The device includes a semiconductor substrate having a high voltage well with a first conductivity type therein. A gate structure is disposed on the semiconductor substrate of the high voltage well. A source doped region and a drain doped region are in the high voltage well on both sides of the gate structure, respectively. A lightly doped region with the first conductivity type is between the source and drain doped regions and relatively near to the source doped region. The disclosure also presents a method for fabricating a high voltage semiconductor device.
Public/Granted literature
- US20150054071A1 HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2015-02-26
Information query
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