发明授权
- 专利标题： Plating catalyst and method
- 专利标题（中）： 电镀催化剂和方法
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申请号： US13732271申请日： 2012-12-31
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公开(公告)号： US09227182B2公开(公告)日： 2016-01-05
- 发明人: Wenjia Zhou , Suk Kwan Kwong , Dennis Chit Yiu Chan , Dennis Kwok Wai Yee , Weijuan Zhou
- 申请人： Rohm and Haas Electronic Materials LLC
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 代理商 John J. Piskorski
- 主分类号： C23C18/30
- IPC分类号： C23C18/30 ; B01J31/06 ; C23C18/18 ; C23C18/40 ; H05K3/42
摘要：
A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface.
公开/授权文献
- US20130171366A1 PLATING CATALYST AND METHOD 公开/授权日：2013-07-04
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