Invention Grant
US09228827B2 Flexible wafer leveling design for various orientation of line/trench
有权
灵活的晶圆调平设计,适用于各种定向/沟槽
- Patent Title: Flexible wafer leveling design for various orientation of line/trench
- Patent Title (中): 灵活的晶圆调平设计,适用于各种定向/沟槽
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Application No.: US13913584Application Date: 2013-06-10
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Publication No.: US09228827B2Publication Date: 2016-01-05
- Inventor: Kuo-Hung Chao , Heng-Hsin Liu , Jui-Chun Peng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G01B11/06 ; G03F9/00

Abstract:
The present disclosure relates to a photolithography system having an ambulatory projection and/or detection gratings that provide for high quality height measurements without the use of an air gauge. In some embodiments, the photolithography system has a level sensor having a projection source that generates a measurement beam that is provided to a semiconductor substrate via a projection grating. A detector is positioned to receive a measurement beam reflected from the semiconductor substrate via a detection grating. An ambulatory element selectively varies an orientation of the projection grating and/or the detection grating to improve the measurement of the level sensor. By selectively varying an orientation of the projection and/or detection gratings, erroneous measurements of the level sensor can be eliminated.
Public/Granted literature
- US20140362359A1 FLEXIBLE WAFER LEVELING DESIGN FOR VARIOUS ORIENTATION OF LINE/TRENCH Public/Granted day:2014-12-11
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