Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US14317008Application Date: 2014-06-27
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Publication No.: US09231177B2Publication Date: 2016-01-05
- Inventor: Hiroki Oguro , Motokazu Yamada , Yasuo Fujikawa
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2013-137693 20130701
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L33/50 ; H01L33/48

Abstract:
Provided is a light emitting device in which deterioration of the substrate member can be reduced. The light emitting device includes a base member mainly made of a resin, a plurality of wiring portions and arranged on the base member via an adhesive agent, a groove portion defined between adjacent wiring portions, and at least one light emitting element which is disposed straddling at least a part of the groove portion. The adhesive agent is applied covering the base member from the groove portion, and contains a light-shielding member. The light-shielding member shields the base member from light, for example at a specific wavelength, emitted from the at least one light emitting element.
Public/Granted literature
- US20150001564A1 LIGHT EMITTING DEVICE Public/Granted day:2015-01-01
Information query
IPC分类: