Invention Grant
- Patent Title: Electromagnetic wave shielding structure and method for fabricating the same
- Patent Title (中): 电磁波屏蔽结构及其制造方法
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Application No.: US13891017Application Date: 2013-05-09
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Publication No.: US09236169B2Publication Date: 2016-01-12
- Inventor: Ming-Tsung Hong , Yun-Ching Lee , Li-Chun Liang , Wei-Ta Yang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW101143371A 20121121
- Main IPC: H01B13/30
- IPC: H01B13/30 ; H05K1/02 ; H05K1/03 ; H05K3/28
Abstract:
Provided is an electromagnetic wave shielding structure, including: a substrate; and a porous composite film formed on the substrate, wherein the porous composite film includes a continuous phase network fused from a plurality of metal nanoparticles, a first resin composition coated on a surface of the continuous phase network and a plurality of holes which are void spaces in the continuous phase network coated with the first resin composition.
Public/Granted literature
- US20140141232A1 ELECTROMAGNETIC WAVE SHIELDING STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-05-22
Information query
