Invention Grant
- Patent Title: Integrated diode array and corresponding manufacturing method
- Patent Title (中): 集成二极管阵列及相应的制造方法
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Application No.: US14049672Application Date: 2013-10-09
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Publication No.: US09240407B2Publication Date: 2016-01-19
- Inventor: Gregor Schuermann , Hubert Benzel
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102012218414 20121010
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L27/08 ; H01L27/14 ; H01L21/00 ; G01J5/00 ; H01L29/66 ; H01L27/146 ; G01J5/08 ; H01L21/762 ; G01J5/02

Abstract:
An integrated diode array and a corresponding manufacturing method are provided. The integrated diode array includes a substrate having an upper side, and a plurality of blocks of several diodes, which are positioned in a planar manner and are suspended at the substrate above a cavity situated below them in the substrate. The blocks are separated from one another by respective gaps, and within a specific block, the individual diodes are electrically insulated from one another by first STI trenches situated between them.
Public/Granted literature
- US20140097511A1 INTEGRATED DIODE ARRAY AND CORRESPONDING MANUFACTURING METHOD Public/Granted day:2014-04-10
Information query
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