Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14308745Application Date: 2014-06-19
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Publication No.: US09252058B2Publication Date: 2016-02-02
- Inventor: Hyung-Seok Hong , Sang-Jin Hyun , Hong-Bae Park , Hoon-Joo Na , Hye-Lan Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2011-0046403 20110517; KR10-2011-0088014 20110831
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/8234 ; H01L21/84 ; H01L27/12 ; H01L21/28 ; H01L29/66

Abstract:
A method of manufacturing a semiconductor device, a semiconductor device and systems incorporating the same include transistors having a gate metal doped with impurities. An altered work function of the transistor may alter a threshold voltage of the transistor. In certain embodiments, a gate metal of a first MOSFET is doped with impurities. A gate metal of a second MOSFET may be left undoped, doped with the same impurities with a different concentration, and/or doped with different impurities. In some embodiments, the MOSFETs are FinFETs, and the doping may be a conformal doping.
Public/Granted literature
- US20140302652A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-10-09
Information query
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