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发明授权
US09257410B2 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate 有权
包含半导体衬底的封装组件，其中半导体衬底的表面的第一部分相对于半导体衬底的表面的第二部分凹陷，以在半导体衬底中形成凹陷区域

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
摘要：
Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.
摘要（中）：

本公开的实施例提供了一种装置，包括具有第一表面的半导体衬底，与第一表面相对设置的第二表面，其中第一表面的至少一部分被凹入以形成半导体衬底的凹陷区域， 以及形成在半导体衬底的凹陷区域中以在半导体衬底的第一表面和第二表面之间提供电或热路径的一个或多个通孔，以及耦合到半导体衬底的管芯，该管芯电耦合到 形成在半导体衬底的凹陷区域中的一个或多个通孔。 可以描述和/或要求保护其他实施例。

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