- Patent Title: Integrated electronic device and method for manufacturing thereof
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Application No.: US14788708Application Date: 2015-06-30
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Publication No.: US09257550B2Publication Date: 2016-02-09
- Inventor: Donato Corona , Nicolo′ Frazzetto , Antonio Giuseppe Grimaldi , Corrado Iacono , Monica Micciche′
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: ITTO2010A0722 20100830
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/66 ; H01L21/02 ; H01L21/04 ; H01L29/10 ; H01L29/16 ; H01L29/732 ; H01L29/808 ; H01L29/165 ; H01L29/06 ; H01L29/08 ; H01L29/40
Abstract:
An embodiment of an integrated electronic device formed in a body of semiconductor material, which includes: a substrate of a first semiconductor material, the first semiconductor material having a first bandgap; a first epitaxial region of a second semiconductor material and having a first type of conductivity, which overlies the substrate and defines a first surface, the second semiconductor material having a second bandgap wider than the first bandgap; and a second epitaxial region of the first semiconductor material, which overlies, and is in direct contact with, the first epitaxial region. The first epitaxial region includes a first buffer layer, which overlies the substrate, and a drift layer, which overlies the first buffer layer and defines the first surface, the first buffer layer and the drift layer having different doping levels.
Public/Granted literature
- US20150325654A1 INTEGRATED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2015-11-12
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