发明授权
US09261780B2 Radiation-sensitive resin composition, method for forming resist pattern, and polymer and compound
有权
辐射敏感性树脂组合物，抗蚀剂图案形成方法，聚合物和化合物
- 专利标题： Radiation-sensitive resin composition, method for forming resist pattern, and polymer and compound
- 专利标题（中）： 辐射敏感性树脂组合物，抗蚀剂图案形成方法，聚合物和化合物
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申请号： US13699003申请日： 2011-05-19
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公开(公告)号： US09261780B2公开(公告)日： 2016-02-16
- 发明人: Yusuke Asano , Yoshifumi Oizumi , Akimasa Soyano , Takeshi Ishii
- 申请人： Yusuke Asano , Yoshifumi Oizumi , Akimasa Soyano , Takeshi Ishii
- 申请人地址： JP Tokyo
- 专利权人： JSR CORPORATION
- 当前专利权人： JSR CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-116771 20100520; JP2010-184494 20100819
- 国际申请： PCT/JP2011/061587 WO 20110519
- 国际公布： WO2011/145702 WO 20111124
- 主分类号： C08F18/20
- IPC分类号： C08F18/20 ; G03F7/039 ; G03F7/20 ; G03F7/004 ; C08F220/26 ; G03F7/038 ; C07C69/653 ; C07C69/753 ; C07D307/93 ; C08F22/18 ; C08F24/00 ; C08F220/24
摘要：
A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a polymer having a structural unit (I) represented by the following formula (1), and (B) a radiation-sensitive acid generator.
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