In one embodiment an apparatus includes a temperature sensor to perform a multiplicity of junction temperature measurements for a component in a platform, a controller comprising logic at least a portion of which is in hardware. The logic may receive from the temperature sensor the multiplicity of junction temperature measurements and may instruct the component to perform a first power down action of the component when a junction temperature measurement exceeds a first threshold, and may instruct the component to perform a second power down action of the component when an average junction temperature based on the multiplicity of junction temperature measurements exceeds a second threshold. Other embodiments are disclosed and claimed.