Invention Grant
- Patent Title: Temporary liquid thermal interface material for surface tension adhesion and thermal control
- Patent Title (中): 临时液体热界面材料，用于表面张力粘附和热控制
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Application No.: US13890776Application Date: 2013-05-09
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Publication No.: US09269603B2Publication Date: 2016-02-23
- Inventor: Luc Guerin , Marc D. Knox , George J. Lawson , Van T. Truong , Steve Whitehead
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Michael LeStrange; Andrew M. Calderon
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.
Public/Granted literature
- US20140332810A1 TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADHESION AND THERMAL CONTROL Public/Granted day:2014-11-13
Information query
IPC分类:
