公开(公告)号：US10784202B2

公开(公告)日：2020-09-22

申请号：US15828463

申请日：2017-12-01

Applicant: International Business Machines Corporation

Inventor： Francois Arguin ,  Luc Guerin ,  Maryse Cournoyer ,  Steve E. Whitehead ,  Jean Audet ,  Richard D. Langlois ,  Christian Bergeron ,  Pascale Gagnon ,  Nathalie Meunier

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00

Abstract: A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.

公开(公告)号：US09793232B1

公开(公告)日：2017-10-17

申请号：US14988077

申请日：2016-01-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Luc Guerin ,  Sylvain Ouimet ,  Sylvain Pharand ,  Thomas A. Wassick

IPC: H01L21/44 ,  H01L23/00 ,  C22C9/06

CPC classification number: H01L24/13 ,  C22C9/06 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/10152 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/81815

Abstract: A standoff structure for providing improved interconnects is provided, wherein the structure employs nickel copper alloy or copper structures having increased resistivity.

公开(公告)号：US20150162300A1

公开(公告)日：2015-06-11

申请号：US14624601

申请日：2015-02-18

Applicant: International Business Machines Corporation

Inventor： Maxime Cadotte ,  Luc Guerin ,  Van Thanh Truong ,  Steve Whitehead

IPC: H01L23/00 ,  B32B38/10 ,  B32B38/00 ,  B32B43/00

CPC classification number: H01L24/799 ,  B08B7/0042 ,  B23K2103/42 ,  B23K2103/50 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/02076 ,  H01L21/31127 ,  H01L24/27 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/40501 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/1917 ,  H01L2924/00

Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

Abstract translation: 提供了一种用于半导体制造工艺的聚酰亚胺的激光灰化系统。 该系统包括：半导体芯片，通过连接层附接到半导体芯片的顶部芯片，支撑材料，设置在支撑材料和半导体芯片之间的聚酰亚胺胶层，等离子体灰化器和灰化激光器， 聚酰亚胺胶在半导体芯片上。

公开(公告)号：US20190172787A1

公开(公告)日：2019-06-06

申请号：US15828463

申请日：2017-12-01

Applicant: International Business Machines Corporation

Inventor： Francois Arguin ,  Luc Guerin ,  Maryse Cournoyer ,  Steve E. Whitehead ,  Jean Audet ,  Richard D. Langlois ,  Christian Bergeron ,  Pascale Gagnon ,  Nathalie Meunier

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/498

Abstract: A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.

公开(公告)号：US09269603B2

公开(公告)日：2016-02-23

申请号：US13890776

申请日：2013-05-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Luc Guerin ,  Marc D. Knox ,  George J. Lawson ,  Van T. Truong ,  Steve Whitehead

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

Abstract translation: 包括用于3D晶片的电/热测试期间使用的用于表面张力粘合和热控制的液体热界面材料的组件和使用方法。 该方法包括通过在其间施加非粘合材料并将薄的晶片和空白的硅基载体晶片压在一起，将薄的晶片临时附接到载体晶片。