Invention Grant
- Patent Title: Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks
- Patent Title (中): 特别是用于粘合电子部件和导体轨道的热活化胶粘带
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Application No.: US12440276Application Date: 2007-09-24
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Publication No.: US09273231B2Publication Date: 2016-03-01
- Inventor: Thorsten Krawinkel
- Applicant: Thorsten Krawinkel
- Applicant Address: DE Norderstedt
- Assignee: tesa SE
- Current Assignee: tesa SE
- Current Assignee Address: DE Norderstedt
- Agency: Norris McLaughlin & Marcus PA
- Priority: DE102006047738 20061006
- International Application: PCT/EP2007/060096 WO 20070924
- International Announcement: WO2008/043660 WO 20080417
- Main IPC: C09J7/00
- IPC: C09J7/00 ; C09J5/06 ; C09J153/02 ; C09J163/00 ; C08L53/02 ; C08L63/00 ; C08J5/12 ; C09J7/02 ; C08K3/00 ; C08L53/00 ; H05K3/38
Abstract:
Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate.
Public/Granted literature
- US20100012271A1 HEAT-ACTIVABLE ADHESIVE TAPE PARTICULARLY FOR BONDING ELECTRONIC COMPONENTS AND CONDUCTOR TRACKS Public/Granted day:2010-01-21
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