发明授权
- 专利标题： Superposed structure 3D orthogonal through substrate inductor
- 专利标题（中）： 通过衬底电感的叠加结构3D正交
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申请号： US14335609申请日： 2014-07-18
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公开(公告)号： US09275786B2公开(公告)日： 2016-03-01
- 发明人: David Francis Berdy , Chengjie Zuo , Daeik Daniel Kim , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka , Jonghae Kim
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： US CA San Diego
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 主分类号： H01F5/00
- IPC分类号： H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/04
摘要：
A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
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