Invention Grant
- Patent Title: Superposed structure 3D orthogonal through substrate inductor
- Patent Title (中): 通过衬底电感的叠加结构3D正交
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Application No.: US14335609Application Date: 2014-07-18
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Publication No.: US09275786B2Publication Date: 2016-03-01
- Inventor: David Francis Berdy , Chengjie Zuo , Daeik Daniel Kim , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/04
Abstract:
A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
Public/Granted literature
- US20160020013A1 SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR Public/Granted day:2016-01-21
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