Invention Grant
- Patent Title: Determination of gain for eddy current sensor
- Patent Title (中): 确定涡流传感器的增益
-
Application No.: US14066509Application Date: 2013-10-29
-
Publication No.: US09275917B2Publication Date: 2016-03-01
- Inventor: Kun Xu , Shih-Haur Shen , Boguslaw A. Swedek , Ingemar Carlsson , Doyle E. Bennett , Wen-Chiang Tu , Hassan G. Iravani , Tzu-Yu Liu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/321 ; B24B37/013 ; B24B49/10

Abstract:
In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.
Public/Granted literature
- US20150118765A1 DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR Public/Granted day:2015-04-30
Information query
IPC分类: