Invention Grant
US09296925B2 Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
有权
薄膜状粘合剂，半导体结合用粘合片，半导体装置的制造方法
- Patent Title: Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device
- Patent Title (中): 薄膜状粘合剂，半导体结合用粘合片，半导体装置的制造方法
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Application No.: US14418661Application Date: 2013-08-02
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Publication No.: US09296925B2Publication Date: 2016-03-29
- Inventor: Yoji Wakayama , Isao Ichikawa , Takashi Akutsu
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Cahn & Samuels, LLP
- Priority: JP2012-172290 20120802
- International Application: PCT/JP2013/070990 WO 20130802
- International Announcement: WO2014/021450 WO 20140206
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; C09J7/02 ; C09J163/00 ; C08F220/18 ; C08G18/75 ; C08G18/80 ; C08G18/10 ; C09J133/06 ; C09J175/16 ; C09J133/14 ; C09J133/00 ; H01L21/78 ; H01L23/00 ; H01L21/683
Abstract:
A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.
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