公开(公告)号：US09296925B2

公开(公告)日：2016-03-29

申请号：US14418661

申请日：2013-08-02

Applicant: LINTEC Corporation

Inventor： Yoji Wakayama ,  Isao Ichikawa ,  Takashi Akutsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C09J7/02 ,  C09J163/00 ,  C08F220/18 ,  C08G18/75 ,  C08G18/80 ,  C08G18/10 ,  C09J133/06 ,  C09J175/16 ,  C09J133/14 ,  C09J133/00 ,  H01L21/78 ,  H01L23/00 ,  H01L21/683

CPC classification number: C09J7/0235 ,  C08F220/18 ,  C08G18/10 ,  C08G18/755 ,  C08G18/8029 ,  C08K5/5419 ,  C08L33/068 ,  C08L61/00 ,  C08L63/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/405 ,  C09J133/00 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/1405 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/463 ,  H01L2221/68381 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F2220/325 ,  C08F220/20 ,  C08F220/14 ,  C08G18/672 ,  C08G18/4825 ,  C08F2220/1858

Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.

Abstract translation: 通过形成含有可聚合硅氧烷化合物的能量射线固化性组合物和在25℃下的粘度为100-5,000,000mPa·S的能量射线固化性树脂的膜而得到膜。

公开(公告)号：US10825711B2

公开(公告)日：2020-11-03

申请号：US15764377

申请日：2016-03-28

Applicant: LINTEC CORPORATION

Inventor： Yasuhiko Kakiuchi ,  Takashi Akutsu ,  Sayaka Bandou ,  Yuichiro Komasu

IPC: H01L21/304 ,  C09J133/08 ,  C09J133/14 ,  C09J7/38 ,  C09J7/20 ,  C09J7/29 ,  B32B27/36 ,  B32B27/32 ,  C08F220/18 ,  C08F220/20 ,  H01L21/683 ,  C09J153/00 ,  C09J133/06 ,  C08F293/00

Abstract: The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.

公开(公告)号：US20150225613A1

公开(公告)日：2015-08-13

申请号：US14418661

申请日：2013-08-02

Applicant: LINTEC Corporation

Inventor： Yoji Wakayama ,  Isao Ichikawa ,  Takashi Akutsu

IPC: C09J7/02 ,  C09J163/00 ,  C09J133/00 ,  H01L21/78 ,  H01L23/00

CPC classification number: C09J7/0235 ,  C08F220/18 ,  C08G18/10 ,  C08G18/755 ,  C08G18/8029 ,  C08K5/5419 ,  C08L33/068 ,  C08L61/00 ,  C08L63/04 ,  C09J7/22 ,  C09J7/30 ,  C09J7/405 ,  C09J133/00 ,  C09J133/068 ,  C09J133/14 ,  C09J163/00 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68336 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/1405 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/463 ,  H01L2221/68381 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F2220/325 ,  C08F220/20 ,  C08F220/14 ,  C08G18/672 ,  C08G18/4825 ,  C08F2220/1858

Abstract: A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25° C. of 100-5,000,000 mPa·S.

Abstract translation: 通过形成含有可聚合硅氧烷化合物的能量射线固化性组合物和在25℃下的粘度为100-5,000,000mPa·S的能量射线固化性树脂的膜而得到膜。

公开(公告)号：US20140342531A1

公开(公告)日：2014-11-20

申请号：US14362933

申请日：2012-12-05

Applicant: LINTEC Corporation

Inventor： Tomochika Tominaga ,  Takashi Akutsu

IPC: H01L21/683 ,  H01L21/78 ,  C09J7/02 ,  H01L21/304

CPC classification number: H01L21/6836 ,  C08G83/007 ,  C08K5/01 ,  C09J7/20 ,  C09J201/02 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/304 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  Y10T428/269 ,  Y10T428/2852

Abstract: To provide an adhesive sheet for wafer processing that satisfies characteristics such as: (1) protecting an uneven circuit surface during grinding with an adhesive force that is not excessively weak; (2) being easy to remove after processing; and (3) leaving very little adhesive residue on the wafer, and that can preferably be used as a removable BG sheet or the like. This adhesive sheet for wafer processing is characterized in having a substrate and an adhesive layer formed on the substrate, the adhesive layer having an adhesive polymer (A) and a polyrotaxane (B) having a linear-chain molecule passing through the opening of the at least two cyclic molecules, and having a block group at both ends of the linear-chain molecule, the adhesive polymer (A) and the cyclic molecule of the polyrotaxane (B) being linked together to form a crosslinked structure.

Abstract translation: 提供一种满足以下特性的晶片加工用粘合片：（1）以不过分弱的粘接力在磨削过程中保护不平衡的电路面; （2）加工后易于除去; 和（3）在晶片上留下非常少的粘合剂残留物，并且可以优选地用作可移除的BG片材等。 这种用于晶片加工的粘合片的特征在于具有在基片上形成的基底和粘合剂层，该粘合剂层具有粘合聚合物（A）和具有穿过该孔的开口的直链分子的聚轮烷（B） 至少两个环状分子，并且在直链分子的两端具有嵌段基团，粘合聚合物（A）和聚轮烷（B）的环状分子连接在一起形成交联结构。