In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.