FUZZY LOGIC CONTROL OF THERMOELECTRIC COOLING IN A PROCESSOR
    1.
    发明申请
    FUZZY LOGIC CONTROL OF THERMOELECTRIC COOLING IN A PROCESSOR 有权
    加热器中热电冷却的FUZZY逻辑控制

    公开(公告)号:US20150185741A1

    公开(公告)日:2015-07-02

    申请号:US14548361

    申请日:2014-11-20

    申请人: Intel Corporation

    IPC分类号: G05D23/19 G06N5/04 G05B15/02

    摘要: In an embodiment, a processor includes a fuzzy thermoelectric cooling (TEC) controller to: obtain a current TEC level associated with the processor; obtain a current fan power level associated with the processor; fuzzify the current TEC level to obtain a first fuzzy fan level; fuzzify the current fan power level to obtain a second fuzzy fan level; determine a new TEC power level based at least in part on the first fuzzy fan level, the second fuzzy fan level, and a plurality of fuzzy rules; and provide the new TEC power level to a TEC device associated with the processor, where the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,处理器包括:模糊热电冷却(TEC)控制器,用于:获得与处理器相关联的当前TEC电平; 获得与处理器相关联的当前风扇功率级; 模糊化目前的TEC等级,获得第一个模糊风扇等级; 模糊当前风扇功率水平,获得第二个模糊风扇等级; 至少部分地基于第一模糊风扇水平,第二模糊风扇水平和多个模糊规则来确定新的TEC功率水平; 并向与处理器相关联的TEC设备提供新的TEC功率级,其中TEC设备将热量从处理器传送到散热器。 描述和要求保护其他实施例。

    Controlling Temperature Of A System Memory
    4.
    发明申请
    Controlling Temperature Of A System Memory 有权
    控制系统内存的温度

    公开(公告)号:US20160048347A1

    公开(公告)日:2016-02-18

    申请号:US14460533

    申请日:2014-08-15

    申请人: Intel Corporation

    IPC分类号: G06F3/06

    摘要: In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,处理器包括执行指令的至少一个核和耦合到所述至少一个核的存储器控​​制器。 反过来,存储器控制器包括备用逻辑,用于响应于第一存储器件的温度超过热阈值,将存储在耦合到处理器的第一存储器件上的数据的动态传输耦合到耦合到处理器的第二存储器件 。 描述和要求保护其他实施例。

    MEMORY POISONING WITH HINTS
    5.
    发明申请

    公开(公告)号:US20190138379A1

    公开(公告)日:2019-05-09

    申请号:US16235949

    申请日:2018-12-28

    申请人: Intel Corporation

    IPC分类号: G06F11/00 G06F11/07

    摘要: A method and system for storing hints in poisoned data of a computer system memory includes receiving poisoned data in a component of the system; forwarding the poisoned data to a memory controller of the system; and forwarding additional data regarding the poisoned data to a memory controller. The memory controller writes the poisoned data to the system memory wherein the written poisoned data includes a poison signature and a hint based on the additional data regarding the poisoned data; and when the written poisoned data is read signaling a system error and returning the poison signature and the hint to a system software of the system.

    Adaptive thermoelectric cooling in a processor
    8.
    发明授权
    Adaptive thermoelectric cooling in a processor 有权
    处理器中的自适应热电冷却

    公开(公告)号:US09297559B2

    公开(公告)日:2016-03-29

    申请号:US14036655

    申请日:2013-09-25

    申请人: Intel Corporation

    IPC分类号: F25B21/02 G06F1/20 G06F1/32

    摘要: In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,处理器包括热电冷却(TEC)控制器,以获得与处理器相关联的平台冷却水平; 获得与处理器相关联的温度; 至少部分基于平台冷却水平和温度计算TEC功率水平; 并且向与处理器相关联的TEC设备提供TEC功率级,其中TEC设备将热量从处理器传送到散热器。 描述和要求保护其他实施例。