Invention Grant
- Patent Title: Motion sensing device and packaging method thereof
- Patent Title (中): 运动感应装置及其包装方法
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Application No.: US14262819Application Date: 2014-04-28
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Publication No.: US09297695B2Publication Date: 2016-03-29
- Inventor: Ming-Hsun Hsieh
- Applicant: LITE-ON SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsin-Tien Dist. New Taipei
- Assignee: Dyna Image Corporation
- Current Assignee: Dyna Image Corporation
- Current Assignee Address: TW Hsin-Tien Dist. New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: CN201310731621 20131226
- Main IPC: G01J1/42
- IPC: G01J1/42 ; H01L25/00 ; H01L25/16 ; H05K13/04 ; H01L31/0232 ; G06F3/0354 ; G06K9/60 ; G06T5/00 ; G06F13/24 ; G01S7/481 ; G01S17/50 ; G06F3/03 ; H01L27/146
Abstract:
A motion sensing device for sensing infrared rays, the motion sensing device includes a substrate; a sensing unit, configured on the substrate for sensing the infrared rays; a stabilizing layer, covering on the sensing unit for fixing and protecting the sensing unit, wherein the stabilizing layer has an opening; a protection layer, formed on the opening; and a coating layer, covering the stabilizing layer for absorbing infrared rays, wherein the coating layer does not cover the opening.
Public/Granted literature
- US20140319348A1 Motion Sensing Device and Packaging Method thereof Public/Granted day:2014-10-30
Information query
