Invention Grant
- Patent Title: Ultra fine pitch PoP coreless package
- Patent Title (中): 超细间距PoP无芯包装
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Application No.: US14088736Application Date: 2013-11-25
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Publication No.: US09305853B2Publication Date: 2016-04-05
- Inventor: Jun Chung Hsu , Jun Zhai
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Gareth M Sampson; Lawrence J. Merkel
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L23/12 ; H01L21/768 ; H01L23/48 ; H01L25/065 ; H01L25/00 ; H01L23/13 ; H01L23/498 ; H01L21/48 ; H01L25/10

Abstract:
A bottom package for a PoP (package-on-package) may be formed with a reinforcement layer supporting a thin or coreless substrate. The reinforcement layer may provide stiffness and rigidity to the substrate to increase the stiffness and rigidity of the bottom package and provide better handling of the substrate. The reinforcement layer may be formed using core material, a laminate layer, and a metal layer. The substrate may be formed on the reinforcement layer. The reinforcement layer may include an opening sized to accommodate a die. The die may be coupled to an exposed surface of the substrate in the opening. Metal filled vias through the reinforcement layer may be used to couple the substrate to a top package.
Public/Granted literature
- US20150061142A1 ULTRA FINE PITCH PoP CORELESS PACKAGE Public/Granted day:2015-03-05
Information query
IPC分类: