- 专利标题： Wafer level reflector for LED packaging
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申请号： US13941784申请日： 2013-07-15
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公开(公告)号： US09343505B2公开(公告)日： 2016-05-17
- 发明人: Hao-Wei Ku , Chung Yu Wang , Yu-Sheng Tang , Hsin-Hung Chen , Hao-Yu Yang , Ching-Yi Chen , Hsiao-Wen Lee , Chi Xiang Tseng , Sheng-Shin Guo , Tien-Min Lin , Shang-Yu Tsai
- 申请人： TSMC Solid State Lighting Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： EPISTAR CORPORATION
- 当前专利权人： EPISTAR CORPORATION
- 当前专利权人地址： TW Hsinchu
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 主分类号： H01L27/15
- IPC分类号： H01L27/15 ; H01L33/48 ; H01L33/60 ; H01L23/00 ; H01L25/16 ; H01L33/54
摘要：
An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.
公开/授权文献
- US20130299855A1 Wafer Level Reflector for LED Packaging 公开/授权日：2013-11-14
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